POLISHING METHOD USING A DOUGHNUT TYPE PAD OF A SEMICONDUCTOR APPARATUS

摘要

PURPOSE: A polishing method using a doughnut type pad of a semiconductor equipment is provided to have every carrier maintain the same polishing characteristic of a semiconductor substrate in each carrier, respectively, by separately adjusting operating characteristics of the carriers associated with a polishing of the semiconductor substrate. CONSTITUTION: A test semiconductor substrate for monitoring a removal rate characteristic of a polishing equipment is polished. A removal rate of the test semiconductor substrate is measured. A polishing start point and a polishing end point of a carrier are adjusted according to the removal rate. The semiconductor substrate is polished using the carrier of which the polishing start point and the polishing end point are adjusted.