| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be easily handled and mounted with a high in mounting density by a method wherein a semiconductor chip is formed into a package of leadless type with all its surface covered with resin. SOLUTION: This semiconductor device is equipped with a base 1, a first electrode 2 and a second electrode 3 formed on the shoulders of the base 1 confronting each other, a chip connected to the top surfaces of the electrodes 2 and 3 through bump 4, and a resin 9 formed covering all the surface of the chip and the top surface of the base 1.
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