发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent contact between a door body and a processed material guide at opening and closing of a door part, in a semiconductor manufacturing device. SOLUTION: An epitaxial growth device is equipped with a wafer guide member 8, which has a passage 7 communicating with the wafer introduction port 5 of a processing chamber 2, and an opening and closing mechanism 8, which opens and closes the passage 7. An opening and closing mechanism 9 is equipped with a door part 10 having the door main body 12 and a cylinder 11 for driving this door part 10, and a circular groove 13 is made at the door body 12, and an O ring 14 is stored in this circular groove 13. A chamfered part 15 is made at the whole of the outside section from the outside fringe 13f, which forms the opening of the circular groove 13 in the open face 12a of the door main body 12. Hereby, when closing the door part 10, even if the door main body 12 should incline slightly to the open face 8a of the wafer guide member 8, the edge of the door main body 12 hardly makes contact with the wafer guide member 8.
申请公布号 JP2000349031(A) 申请公布日期 2000.12.15
申请号 JP19990148134 申请日期 1999.05.27
申请人 APPLIED MATERIALS INC 发明人 SAITO KAZUYOSHI;TAKAGI YOJI
分类号 H01L21/677;B65G49/00;C23C16/54;C30B25/08;C30B35/00;F16K51/02;H01L21/00;H01L21/205;(IPC1-7):H01L21/205 主分类号 H01L21/677
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