发明名称 DEVICE FOR SUCKING AND HEATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate sucking and heating device which can facilitate replacing operation by dividing a stage block into an upper and a lower part, providing a heater and a temperature sensor to the lower stage block, and replacing the upper stage according to the sizes of the substrates and greatly reduce the cost for the replacement. SOLUTION: This is a device which arranges a substrate 1 for PGA package mounting on a suction and heating stage and sucks and heats the substrate; and the stage is equipped with the temperature sensor 6 and heating means 5 and consists of a lower stage block 3 where a specific flow passage 7 for suction communicating with a suction source is open on the top surface and an upper stage block where a passage part communicating with the flow passage is formed on its reverse surface and also linked with a recessed part for suction.
申请公布号 JP2000349430(A) 申请公布日期 2000.12.15
申请号 JP19990154945 申请日期 1999.06.02
申请人 NEC TOHOKU LTD 发明人 ONODERA KINICHI
分类号 H05K3/34;H01L21/60;(IPC1-7):H05K3/34 主分类号 H05K3/34
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