BONDING FILM FOR PRINTED CIRCUIT BOARDS

摘要

PURPOSE: An adhesive film for a printed circuit board is provided, to improve mechanical strength, flexibility, flame retardancy, adhesion, heat resistance, resistance to lead welding and crack resistance. CONSTITUTION: The adhesive film comprises 100 parts by weight of a polymer epoxy resin having a weight average molecular weight of 50,000 or more; 1-100 parts by weight of a polyamide selected from the group consisting of a polyamide having a polyalkylene glycol residue and a soluble polyamide resin; 5-200 parts by weight of a multifunctional epoxy resin; and optionally a curing agent for an epoxy resin. Preferably the polymer epoxy resin is obtained by polymerizing a bifunctional epoxy resin and a bifunctional phenol resin; the polyalkylene glycol residue comprises polytetramethylene ether glycol residue; and the soluble polyamide resin is soluble in at least one solvent selected from the group consisting of an amide solvent, a ketone solvent and a lactone solvent.