| 摘要 |
PURPOSE: A hemming device is provided to offset or remove pressurized load from the upper direction of a lower mold die by pressurizing in upper and lower directions at the same time when a pressure device adjacent to a lower mold die pressurizes from the upper direction. CONSTITUTION: A hemming device includes a lower mold die(2) on which a set panel(W) is positioned, a pressure pad(5) pressing the panel on the lower mold die to determine a position of the panel, a processing unit(10) mounted at the circumference of the lower mold die and pressuring the panel from the upper direction by a hemming blade(20), and a chucking hemming unit having a lower processing unit for pressuring the lower surface of the lower mold die upwardly at the same time with pressuring the upper portion of the panel.
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