发明名称 |
METHOD FOR MANUFACTURING A GATE STRUCTURE OF A SEMICONDUCTOR DEVICE USING A LIQUID PHASE DEPOSITION |
摘要 |
PURPOSE: A method for manufacturing a gate structure of a semiconductor device using a liquid phase deposition is provided to form a cobalt silicide pattern, by using a silicon oxidation layer in a selective liquid phase deposition without using a selective dry etching process. CONSTITUTION: A silicon layer is formed on a semiconductor substrate(100). A photoresist layer pattern is formed on the silicon layer. The silicon layer is patterned to form a silicon pattern by using the photoresist layer pattern as an etch mask. A silicon oxidation layer(400) exposing an upper surface of the photoresist layer pattern is selectively formed in a liquid phase deposition by using a selective characteristic with the photoresist layer pattern on a semiconductor substrate exposed by the silicon pattern(250). The photoresist layer pattern is eliminated. A cobalt silicide pattern filling a gap(450) between the silicon oxidation layers is formed on the silicon pattern exposed by eliminating the photoresist layer pattern. The silicon oxidation layer is eliminated.
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申请公布号 |
KR20000074728(A) |
申请公布日期 |
2000.12.15 |
申请号 |
KR19990018861 |
申请日期 |
1999.05.25 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
KOO, JA HEUM;KIM, HYEONG SEOP;YOO, JAE YUN |
分类号 |
H01L21/334;(IPC1-7):H01L21/334 |
主分类号 |
H01L21/334 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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