TAPE-CARRIER-PACKING SEMICONDUCTOR DEVICE AND A LCD PANEL DISPLAY USING SUCH A DEVICE AS WELL AS A METHOD FOR TESTING THE DISCONNECTION THEREOF

摘要

A slit is formed in a polyimide substrate and a copper wiring pattern is formed on the surface of the polyimide substrate. Moreover, solder resist, which has a young's modulus in the range of 5 kgf/mm<2 >to 70 kgf/mm<2 >and contains a filler in the range of 10 wt % to 40 wt %, is formed on the copper wiring pattern. Thus, the copper wiring pattern becomes less susceptible to disconnection, and it is possible to provide a flex TCP semiconductor device with high manufacturing yield.