发明名称 |
METHOD FOR ETCHING A METAL LAYER AND A METHOD FOR MANUFACTURING A THIN FILM TRANSISTOR USING THE SAME |
摘要 |
PURPOSE: A method for manufacturing a thin film transistor(TFT) using a method for etching a metal layer is provided to decrease the number of photo processes by simultaneously etching a stacked metal layer of more than two layers, and to simplify the overall process by removing the process to eliminate an overhang. CONSTITUTION: An active layer having source/drain regions is formed on an insulating substrate(300). The first and second metal layers(302,306) are consecutively formed on the active layer by interposing an insulating layer. A plasma process is performed regarding a part of the second metal layer or the entire surface of the second metal layer. A part of the plasma-processed first and second metal layers is eliminated until the insulating substrate is exposed, to form a barrier layer and a gate electrode. Source/drain electrodes connected to the source/drain regions are formed on the insulating substrate.
|
申请公布号 |
KR20000074461(A) |
申请公布日期 |
2000.12.15 |
申请号 |
KR19990018423 |
申请日期 |
1999.05.21 |
申请人 |
LG.PHILIPS LCD CO., LTD. |
发明人 |
KIM, UNG GWON;BAE, SEONG SIK |
分类号 |
H01L29/49;(IPC1-7):H01L29/49 |
主分类号 |
H01L29/49 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|