发明名称 PHENOLIC THERMOSETTING RESINS CONTAINING POLYOLS
摘要 <p>Disclosed is a resol phenolic thermosetting resin made by preparing a composition of formaldehyde and a phenol in a molar ratio of about 1:1 to about 3:1, about 1 to about 20 wt%, based on the weight of said composition, of a phenol-formaldehyde polymerization catalyst, and about 0.5 to about 10 wt%, based on the weight of said phenol, of a polyvinyl alcoholic compound. The phenol can be benzophenol, an alkyl from C1 to C12 phenol, a bisphenol, or a mixture thereof. The bisphenol can be bisphenol A, bisphenol F, or bisphenol S. The polyvinyl alcoholic compound can be polyvinyl alcohol, polyvinyl acetate, an acetal derived from polyvinyl alcohol, or a mixture thereof. The composition is heated at about 50 to about 120°C to form the resin.</p>
申请公布号 WO2000075230(A1) 申请公布日期 2000.12.14
申请号 GB1999001822 申请日期 1999.06.09
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