发明名称 IMAGE SENSOR PACKAGE WITH IMAGE PLANE REFERENCE
摘要 An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.
申请公布号 WO0076001(A1) 申请公布日期 2000.12.14
申请号 WO2000US40062 申请日期 2000.06.02
申请人 SILICON FILM TECHNOLOGIES, INC. 发明人 STERN, JONATHAN, MICHAEL;SAPIR, ITZHAK;HORNBACK, WILLIAM, B.
分类号 H04N5/225 主分类号 H04N5/225
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