| 发明名称 |
ENCAPSULATION OF PRINTED CIRCUIT BOARD |
| 摘要 |
A housing for electronic components is injection molded as a unitary, single-piece, monolithic piece, and includes a front cover, a back cover, and a living hinge. Electronic components, including a PCB, are contained within the housing. A cosmetic cover is secured to the housing over the living hinge, which protrudes from the housing, to make the housing more appealing.
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| 申请公布号 |
WO0076283(A1) |
申请公布日期 |
2000.12.14 |
| 申请号 |
WO2000EP04862 |
申请日期 |
2000.05.29 |
| 申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
LARSSON, MATS;SIMONSSON, OLOF;OLSSON, MATS;PORTELA, RAFAEL;MOESTER, ERIK;LARSSON, PAUL |
| 分类号 |
H05K5/00;B29C65/08;B29C65/56;B29C65/58;E05D1/02;E05D11/00;H05K5/02;H05K5/03;H05K7/14;(IPC1-7):H05K5/02;H04M1/02 |
主分类号 |
H05K5/00 |
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