| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure enabling separation between a bonding component and a bonded component to be prevented even in the case that the bonding component and the bonded component are bonded with an adhesive and temperature differences in the respective components themselves arise because of partial heating or cooling after separation between the above components has occurred. SOLUTION: In a bonding structure where a bonding component 1 and a bonded component 2 are bonded with an adhesive 3, at least one bore 5 into which the adhesive 3 penetrates is perforated in at least one of surfaces to be bonded of both the bonding component 1 and the bonded component 2 and gaps 4 are formed between projections 3a, 3b formed by the adhesive 3 which penetrated and then solidified in bores 1a, 2a and inner walls of bores 1a, 2a.
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