发明名称 MOISTURE-CURING HOT-MELT COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curing hot-melt adhesive composition having isocyanato groups in the molecule, with a sufficient adhesive power even in an uncured state, and free from a defective appearance such as blistering when cured. SOLUTION: The composition consists of 100 pts.wt. crystalline polyester polyol having a melting point measured by a differential scanning calorimeter(DSC) of 30-80 deg.C and 1-30 pts.wt. thermoplastic resin having functional groups reactive with isocyanato groups and having a number-average molecular weight of 7,000 to 50,000 and a softening point measured by the method according to the Japan Adhesive Industry Standard JAI-7-1991 of 150 deg.C or lower, wherein the composition has the terminal functional groups reacted with an isocyanate compound.
申请公布号 JP2000344852(A) 申请公布日期 2000.12.12
申请号 JP19990159670 申请日期 1999.06.07
申请人 SEKISUI CHEM CO LTD 发明人 KUSUDA SATOSHI
分类号 C08G18/42;C08G18/40;C09J5/06;C09J175/06;(IPC1-7):C08G18/42 主分类号 C08G18/42
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