发明名称 PRODUCTION OF THERMOSETTING POLYAMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide resin being excellent in chemical resistance and uniformity in the state of a solution and used as a binder for various powders to enable them to form a slurry excellent in storage stability by reacting a thermosetting polyamide resin having amide bonds, ester bonds, and secondary hydroxyl groups with a cellulosic compound. SOLUTION: A diisocyanate or a diamine is reacted with a dicarboxylic acid in an organic solvent to obtain a carboxyl-terminated polyamide resin represented by formula I (wherein R1 is a 4-20C diisocyanate residue or a 2-120C diamine resin; R2 is a 2-120C dicarboxylic acid residue; and n is a positive integer). A polyamide resin of formula I is reacted with an epoxy resin in an organic solvent to obtain a thermosetting polyamide resin having ester bonds and secondary hydroxyl groups and represented by formula II (wherein R3 is an epoxy resin residue; and m is a positive integer). A resin component (100 pts.wt.) of formula II is reacted with 1-500 pts.wt. cellulosic compound to obtain a thermosetting polyamide resin.
申请公布号 JP2000344860(A) 申请公布日期 2000.12.12
申请号 JP19990155069 申请日期 1999.06.02
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI KENJI
分类号 C08G69/48;C08G59/22;C08G59/62;C08G81/00;(IPC1-7):C08G59/22 主分类号 C08G69/48
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