发明名称 FLOOR HEATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a floor heating structure allowing safe use of a floor substrate as a scaffolding of other interior works without using a permanent covering material, and easy replacement of a floor material locally or fully. SOLUTION: In the floor heating structure, one floor substrate unit 2 provided with a support leg 4 having a panel receiving member 41 mounted across a lower side so as to connect floor substrate panels 3 adjacent to a plurality of floor substrate panels 3 is arranged on a floor base panel 1, a plurality of heat generation panels 5 for floor heating are installed on the floor substrate unit 2, and a plurality of floor members 6 are installed on the heat generation panels 5, and working parts 61, 62 for joining provided on edge parts opposite to each other of the adjacent floor members 6 are joined with each other.
申请公布号 JP2000345694(A) 申请公布日期 2000.12.12
申请号 JP19990155970 申请日期 1999.06.03
申请人 ASAHI WOODTEC CORP 发明人 ITO AKIRA;MUKOYAMA SHUJI
分类号 E04F15/18;E04F15/00;F24D13/02;F24D19/02;(IPC1-7):E04F15/18 主分类号 E04F15/18
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