| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for forming a solder mask. SOLUTION: A method for forming a solder mask includes a step, in which a board 100 which has a plurality of wires 102 with a plurality of bonding pads 102a is prepared, a step in which a 1st solder resist layer is formed to cover a plurality of wires 102 and the board 100, a step in which the 1st solder resist layer is partially removed to expose the plurality of wires 102, a step in which a 2nd solder resist layer is formed to cover the plurality of wires 102 and the remaining 1st solder resist layer, and a step in which the 2nd solder resist layer is partially removed to expose the plurality of bonding pads 102a.
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