| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetic head device that the amount of heat generated from an IC chip is more efficiently radiated. SOLUTION: A magnetic head device is provided with a magnetic head slider which has at least one thin film magnetic head element, a supporting mechanism which supports the slider, an IC chip 12 which mounts the circuit for the element, and a wiring member which is mounted on the mechanism and in which the chip 12 is bonding packaged. The chip 12 is provided with plural heat radiating bonding bumps besides the bumps 20 which are required for the packaging.
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