| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for an electric part capable of miniaturizing while keeping a displacement quantity of a contact pin. SOLUTION: In this IC socket 11, a mounting surface part 19a to mount an IC package serving as 'an electric part' on a socket body 13, and plural contact pins 15 capable of being brought into contact with and detachable from a solder ball 12b serving as 'a terminal' are disposed on the socket body 13. The contact pins 15 are arranged so as to form a matrix shape having a longitudinal row and a lateral row, and each side of a quadrilateral forming the outer rim of the matrix-shaped arrangement area is in parallel with each side of a quadrilateral forming the outline of the IC socket, when viewing the usage condition of the IC socket 11 on a plane. In each contact pin 15, contact parts 15e, 15f brought into contact with and detached from the solder ball 12 are formed at the tip part of an elastic piece, and the displacement direction N1 of the contact parts 15e, 15f has a fixed angle to the arrangement direction N2 of the longitudinal row and the lateral row of the contact pins 15.
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