| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, which is highly reliable to mechanical stresses and can be mounted at a high density. SOLUTION: A plurality of connection pads 4 are provided on the surface, which is mounted with a rectangular semiconductor unit 2, of a glass epoxy substrate in a dotted type in the state corresponding to external terminals 3 under the unit 2. Substrate wirings 6 for electrically connecting with other electronic component through the pads 4 are led out in the opposite directions to the directions of the one pair of the sides 2A and 2C opposing each other of a mounting region 2E and are formed. The number of the lead-out sides of the region 2E can be reduced, there is no need to ensure the laying space for the substrate wirings 6, components adjacent to the substrate wirings 6 can be arranged at the positions, where the wirings 6 are not led out, and a high-density mounting can be performed on a wiring board.
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