| 摘要 |
PROBLEM TO BE SOLVED: To evenly heat all lead terminals so that it is press-fitted to soldered pads by allowing a resist non-formation region, or the surfaces of soldered pads, to cross the soldered pad by a specified width and length. SOLUTION: When a solder resist 3 is provided on a printed wiring board 10, a resist non-formation region 11 is so set as to cross a soldered pad 2 except for the surface of soldered pad 2. Related to the resist nonformation region 11, the length Lp of the soldered pad 2 is relative to the number and pitch P of it. In short, the resist non-formation region 11 so crosses the soldered pad 2 as Lp/2<Wr<Lp for its width Wr, while as n.P<Lr for its length Lr.
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