| 摘要 |
PROBLEM TO BE SOLVED: To obtain connection reliability of a bonding wire, even when it is used under a thermally and mechanically severe environments such as an engine room. SOLUTION: This device is composed of a semiconductor bare chip 3 provided with a connecting electrode 30 and a wiring board 2 provided with a pad 20 for a bonding wire and is constituted by welding the bonding wire 4. The bonding wire used has a diameter of 100-500 μm and a plurality of recessed or protruded folded portions 43a to 43c formed in a bent portion 43. |
