| 摘要 |
PROBLEM TO BE SOLVED: To enable reduction of dishings and erosion in a step of polishing a wiring layer other than a wiring layer embedded in a groove for the wiring layer made in an insulation film or the like by a chemical and mechanical polishing(CMP) method. SOLUTION: Prior to the step of making grooves 14 for a wiring layer in an insulating film 9, a step is provided of forming projected steps 12 of a non- photosensitive material in the vicinity of the grooves 14. For example, a step is provided for removing a barrier metal film 15 and a wiring metal layer 16 on the insulating film 9, to form a damascene wiring layer made of the barrier metal film 15 embedded in the grooves 14 and the metal layer 16.
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