发明名称 SUBSTRATE POSITIONING AND SUBSTRATE BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To make it possible to move a stage in a prescribed direction and to position a substrate to be treated by converting the moving action of a moving member by driving of a drive shaft to the moving action of the stage according to the inclination of a tapered part. SOLUTION: When a ball screw shaft 25 is rotated by the drive of a drive motor 23, a ball screw nut 27 moves on a shaft according to the rotating direction and rotating quantity thereof and a housing 28 integral therewith is guided by a rectilinearly moving guide and is moved in an X direction. At this time, the tapered part 30a of an intermediate member 30 has a prescribed inclination with respect to the axial direction X of the ball screw shaft 25 and the moving direction of the housing 28 is limited to the axial direction X of the ball screw shaft 25 by the rectilinearly moving guide. The moving action of the housing 28 in the X direction is, therefore, converted to the moving action of the Y state 15 according to the inclination of the tapered part 30a. The Y stage 15 may be moved in a Y direction by the drive of the drive motor 23.</p>
申请公布号 JP2000338896(A) 申请公布日期 2000.12.08
申请号 JP19990150890 申请日期 1999.05.31
申请人 SONY CORP 发明人 ASANO TAKESHI
分类号 H01L21/68;G02F1/13;G02F1/1333;G09F9/00;(IPC1-7):G09F9/00;G02F1/133 主分类号 H01L21/68
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