| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a wiring member, capable of being made high in density, finely wired and superior in electrical characteristics, for an interposer or a wiring member, for forming a semiconductor device to mount a semiconductor element on a printed circuit board, and the manufacturing method of the wiring member for interposer or the wiring member for forming the semiconductor device. SOLUTION: A process, wherein through-holes 115 for forming via holes are provided in a metal plate material to form a conductive substrate 110, and a process, wherein a substrate with the one surface having a conductivity on one side of its surfaces is used as a base material 210, terminals 135 for forming the via holes are included in the conductive surface of the base material 210 and wiring parts are formed on the base material 210 through selective plating to form a transfer plate, are performed, and thereafter, the side which is provided with the wiring parts of the transfer plate is aligned with the substrate 110, both of the substrate 110 and the transfer plate are made to adhere closely to each other via an insulating adhesion layer 140, the exposed parts of the substrate 110 are covered with the layer 140, an insulating layer 120 is provided at the rear of the substrate 110 in such a way as to fill the holes 115, then the layer 120 in the via holes is removed to make the terminals 135 in the wiring parts expose, apertures 150 are provided in the substrate 110, the apertures 150 are filled by electrolytic plating, the via holes 160 are formed in the substrate 110, and the base material 210 is separated from the substrate 110.</p> |
