发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with a multilayer gate electrode, which has a low-resistance film with low oxidation resistance on a polysilicon film, and a self-aligned contact. SOLUTION: A gate electrode 21 consists of a lower electrode 21a, made of a polysilicon film and an upper electrode 21b containing a low-resistance film. A first nitride sidewall 32 is formed at least on the sides of the upper electrode 21 and an insulator cap 31, and a protective oxide film 34 is formed at least on a portion of the lower electrode 21a and the top surface of a semiconductor device. Since the first nitride sidewall 32 and a second nitride sidewall 33 which covers the protective oxide film 34 are formed, a self-aligned contact hole can be formed, when etching is conducted. As a result, a semiconductor device having a highly reliable self-aligned contact can be obtained.
申请公布号 JP2000340792(A) 申请公布日期 2000.12.08
申请号 JP20000042495 申请日期 2000.02.21
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 UEHARA TAKASHI;KANAZAWA MASATO
分类号 H01L21/8247;H01L21/28;H01L21/302;H01L21/3065;H01L21/336;H01L21/768;H01L27/115;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L29/78;H01L21/306;H01L21/824 主分类号 H01L21/8247
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