| 摘要 |
PROBLEM TO BE SOLVED: To shorten necessary work time and inspection time by bonding an IC chip from above an under-filling material fixed in a position for loading the IC chip having a circuit for a thin-film magnetic head, which is carried out by using ultrasonic waves. SOLUTION: When an under-filling material 25 is dropped and added, the center part of the under-filling material 25 is formed to be projecting upward in shape. By such the shape, when an IC chip 12 is placed thereon and a load is applied, the occurrence of inconvenience, such as a left gap, is prevented between the bottom surface thereof and a thin-film pattern surface. After the IC chip 12 is gripped while an ultrasonic head 27 is pressed to its surface, and positioned in the part of a connecting pad 23, pressing is applied from above the added under-filling material 25 and ultrasonic waves are applied such that an Au ball bump 26 of the IC chip 12 is pressed to the thin-film pattern connecting pad 23.
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