发明名称 |
ADHESIVE FORMULATIONS |
摘要 |
An adhesive composition including as principal components: a) about 10-90 % by weight of at least one free radical-polymerizable monomer; b) about 0-20 % by weight of an adhesion promoter; c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a) - (d).
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申请公布号 |
WO0073397(A1) |
申请公布日期 |
2000.12.07 |
申请号 |
WO2000US14043 |
申请日期 |
2000.05.22 |
申请人 |
LORD CORPORATION |
发明人 |
HUANG, JIAN-PING;RIGHETTINI, ROBIN, F.;DENNIS, FRANCES, G. |
分类号 |
C08F290/04;C08F290/06;C09J4/06;C09J153/02;(IPC1-7):C09J4/06 |
主分类号 |
C08F290/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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