发明名称 |
Microsensor has micro electro-mechanical sensor element mounted directly on integrated circuit, connected with positional accuracy and electrically conductively via peripheral solder seam |
摘要 |
The microsensor has a microelectromechanical sensor element (1) and an integrated circuit (4) for measurement, calibration and compensation electronics, whereby the sensor element is electrically connected to the IC. The microelectromechanical sensor element is mounted directly on the IC and connected with positional accuracy and electrically conductively via a peripheral solder seam (3). |
申请公布号 |
DE10027234(A1) |
申请公布日期 |
2000.12.07 |
申请号 |
DE2000127234 |
申请日期 |
2000.05.31 |
申请人 |
AUSTRIA MIKRO SYSTEME INTERNATIONAL AG, UNTERPREMSTAETTEN |
发明人 |
BRANDL, MANFRED |
分类号 |
B81B7/00;G01P1/02;G01P15/125;G01P15/13;H01L29/06 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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