PACKING METHOD OF FIELD EMISSION DISPLAY

摘要

PURPOSE: A field emission display packaging method is provided to improve manufacturing productivity and to reduce cost by executing exhaust for vacuum and sealing process simultaneously using silicide in case executing in high vacuum chamber. CONSTITUTION: A silicon layer is deposited at a lower surface(210) after making a hole for exhaust in a selected area of the lower substrate(210) at which a field emission display(200) is formed. An upper substrate(220) at which a transparent electrode and a phosphor are formed and the lower substrate(210) are supported and sealed parallel with a side wall(230). A metal cap(250) is located at the exhaust hole after forming vacuum inside the substrate through the hole for exhaust. A heat treatment process is proceeded so that a silicide(260) generated by the reaction of the metal cap(250) and the silicon layer seals the hole fully for exhaust, and then a sealing process is made by a binder(270). The metal cap(250) is one of Paradium(Pd). Cobalt(Co), Titanium(Ti), Chrome(Cr), Tungsten(W), Tantalium(Ta), Nickel(Ni), Molybdenum(Mo), and Platinium(Pt).