| 摘要 |
PROBLEM TO BE SOLVED: To enhance the occupancy ratio of semiconductor elements, enable downsizing, and improve the packing density on a circuit board by sealing terminals, the semiconductor elements and bonding wires with sealing members so as to expose the top end of outer terminals of each terminal part to the outside. SOLUTION: A resin-sealed semiconductor device 11 comprises a plurality of terminal parts 12 of inner and outer terminals 13, 14 disposed in two rows at prescribed spacings, a semiconductor element 15 located in approximately the center of a space where the terminal parts 12 are disposed, bonding wires 17 connecting terminals 15a of the semiconductor element 15 to the terminal parts 12, and sealing members 18 for sealing the terminal parts 12, the bonding wires 17 and the semiconductor element 15. Each terminal part 12 is electrically disposed independently being approximately flush with the inner terminal 13 facing the same plane. The outer terminal 14 is composed of a buried part 14a located in the seal member 18 and a top end part 14b exposed to protrude from the back side of the resin-sealed semiconductor device 11. |
