| 摘要 |
PROBLEM TO BE SOLVED: To provide a method wherein spherical members for bump electrode formation such as a large number of metal balls can be exactly and effectively transferred one by one, and productivity is satisfactory or a manufacturing method of a semiconductor device, and additionally a mask for transfer used in the method. SOLUTION: In a process where flux 8 is mounted on an UBM film 7 formed on an Si wafer 5, a metal ball 1 is transferred to the flux 8, and a bump 13 is formed by reflow, a guide mask (a mask for transfer) 10 is used for transfer of the metal ball 11. The guide mask 10 has an aperture 9, into which the one metal ball 11 can be dropped. The aperture 9 has a diameter in the depth direction which is larger than that of entrance side. |
