| 摘要 |
PROBLEM TO BE SOLVED: To realize manufacturing method of a semiconductor device which uses a flip-chip mounting method where imperfect soldering is not generated even when a printed wiring board having flexibility is used as a wiring board, and connection satisfactory in yield is enabled. SOLUTION: This method is provided with a process forming solder bumps 8 on electrode pads 7 of a semiconductor chip 6, a process for spreading flux 3 on lands 2 of a wiring board 1, a process for aligning the solder bumps 8 with the lands 2 by using a bonding tool 5, a process for bringing the solder bumps 8 into contact with the lands 2 and heating and activating the flux 3, a process for isolating the solder bumps 8 once at a prescribed distance from the lands 2, a process for heating and fusing the solder bumps 8, and process for performing soldering by bringing the fused solder bumps 8 into contact with the lands.
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