| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which many bump electrodes can be accurately transferred one by one. SOLUTION: In a step of forming bumps by transferring metallic balls 11 to flux 8 placed on UBM films 7 formed on an Si wafer 5 and reflowing the balls 11, a guide mask 10 is used for the transfer of the balls 11. The mask 10 has nearly the same thickness as the diameter (r) of the balls 11 and, in addition, openings 9 in each of which one ball 11 can fall.
|
