发明名称 SUBSTRATE PROCESSOR AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent generation of contamination on a substrate due to dust, etc., by processing the substrate from its one-sided surface, when processing it in the state of supporting it, and by making the support contacted only with the whole periphery not unnecessary requiring processing. SOLUTION: A contact porting 24 of a support member 1 with a substrate 2 is set only to the peripheral edge portion of the substrate 2, and the substrate 2 is supported over the whole periphery of its peripheral edge portion only in the substrate 2 and the contacting portion 24, when observing it from its upper side. In this way, when rinsing a rear surface 22 of the substrate 2, the support member 1 for supporting the substrate 2 chucks an element-forming surface of the substrate 2 (the front surface thereof), and it supports the substrate 2 by selecting as its top surface the rear surface 22 of the substrate 2. At this time, the contacting portion 24 of the supporting member 1 with the substrate 2 corresponds to the processing unnecessary portion of an element forming surface 21 of the substrate 2. Furthermore, a rear-surface rinsing nozzle 6 for rinsing the rear surface 22 of the substrate 2 is provided on the same side as its resist nozzle, to perform both its resist-applying and rinsing treatments on the same side.
申请公布号 JP2000331919(A) 申请公布日期 2000.11.30
申请号 JP19990141740 申请日期 1999.05.21
申请人 SONY CORP 发明人 HORIUCHI TOSHIHIRO
分类号 H01L21/683;G03F7/16;H01L21/027;H01L21/304;H01L21/68 主分类号 H01L21/683
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