LASER MACHINING OF PLASTIC FILM OF CIRCUIT BOARD, AND METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

A plastic film or a laminate of plastic layers, which is placed on a worktable (5) movable substantially at a right angle with the scanning direction of a laser beam (7), is scanned in one or two ways by the laser beam to open a hole. This method can be used to open holes in the plastic film of a circuit board or double-sided carrier tape. Since a continuous-wave carbon dioxide gas laser beam is used as the laser beam (7), the rigid-flex circuit board or double-sided carrier tape can be worked efficiently, accurately with high yield.