| 摘要 |
PROBLEM TO BE SOLVED: To shorten a period of time required for controlling the pressure of a cooling gas and improve the throughput. SOLUTION: This method for controlling the pressure of a cooling gas is used to control the pressure of a gas for cooling the rear of a wafer W to a set pressure P during processing of the wafer, and it includes a first step to calculate a preliminary pressure parameter, N=(V1+V2)/V1 (V1: Volume of a first part of a cooling gas supply route divided by an inlet valve IV and a final valve FV; V2: Volume of a second part of the cooling gas supply route between the final valve FV and a gas jetting hole), a second step to fill the first part with a cooling gas and set the pressure Py of the cooling gas of the first part to P<Py<=N×P, and a third step to open the last valve and fill the first and second parts with the cooling gas applied in the second step.
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