| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of bonding electronic components and a substrate, using a conductive adhesive whereby even in a fine pattern severe in accuracy requirements the electric insulation can be easily and reliably maintained. SOLUTION: On a flat plate a conductive adhesive of 20-500μm thickness is formed, electronic components are laid and pressed on the conductive adhesive layer, the electronic components are peeled off to transfer a required quantity of conductive adhesive to bond regions of the electronic components to a board, the electronic components with the transferred conductive adhesive are pressure- bonded to specified positions on the board, and the conductive adhesive is cured at high temperatures to bond electronic components and the board.
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