| 摘要 |
PROBLEM TO BE SOLVED: To obtain low temperature sintering glass ceramics capable of being fired at <=1,000 deg.C, capable of incorporating a low resistance conductor such as Au, Ag or Cu by simultaneous firing and suitable for the insulating layer of a multilevel interconnection board for mounting with a high-frequency analogue circuit having a low dielectric constant and a small dielectric loss in a frequency domain of microwaves and millimeter waves. SOLUTION: A glass having a composition consisting of 10-45 wt.% SiO2, 20-50 wt.% CaO, 20-45 wt.% Al2O3, 0.1-5 wt.% MgO, 0.1-5 wt.% SrO, 0.1-5 wt.% BaO, 0.1-5 wt.% TiO2, 0.1-5 wt.% ZnO, 0.1-5 wt.% ZrO2 and 0-3 wt.% oxide of a group IA element (expressed in terms of oxides) has a low softening point, can be fired at <=1,000 deg.C in the form of a composite with various ceramics, deposits crystals in a firing process and forms the objective glass ceramics having a low dielectric constant and a small dielectric loss, capable of multilevel interconnection with a low resistance conductor and giving a multilevel interconnection board excellent in high-frequency characteristics. |
