发明名称 HEAT-BONDABLE LID MATERIAL AND PACKAGING BODY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the moisture-resistance, the oxygen inpermeability and the light-shielding property, and enhance the incineration property and the shape-retentivity by inserting a nylon film having a thickness which is in a specified range of magnification of an aluminum foil, between the aluminum foil having a thickness in a specified range and a heat-bonding layer. SOLUTION: This heat-bondable lid material 1 is constituted by laminating an external packaging resin film 2, an aluminum foil 3, a nylon film 4 and a heat-bonding layer 5. In this case, the thickness of the aluminum foil 3 is set to be 3 to 18μm. Also, for the nylon film 4 located between the aluminum foil 3 and the heat-bonding layer 5, a nylon film having a thickness which is 2 to 8 times that of the aluminum foil is used. By this constitution, the shape retentivity is enhanced by a multiplier effect of an inclination that the lid material 1 curls to the opposite side from the discharging direction of a content by the moisture absorbing property of the nylon film 4, and the shape retentivity of the aluminum foil 3. Also, the easily burning property is excellent because the thin aluminum foil 3 is used. In addition, the corrosion resistance is secondarily excellent as well.
申请公布号 JP2000327035(A) 申请公布日期 2000.11.28
申请号 JP19990142127 申请日期 1999.05.21
申请人 TOYO ALUMINIUM KK 发明人 TAKAHASHI KAZUTOSHI;MORIWAKI HIDEZO;SEKIGUCHI TOMONOBU;SHIBAMURA YOSHIAKI
分类号 B65D77/20;(IPC1-7):B65D77/20 主分类号 B65D77/20
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