| 发明名称 |
High density cross-connection system |
| 摘要 |
Secondary backplane boards are secured to a main backplane board to provide interconnection paths in a direction transverse to interconnection paths provided on the main backplane board, so that current manufacturing capabilities of multi-layer backplane boards are not exceeded.
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| 申请公布号 |
US6154373(A) |
申请公布日期 |
2000.11.28 |
| 申请号 |
US19990275332 |
申请日期 |
1999.03.24 |
| 申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
DURSTON, ANDREW C.;HWANG, LIANG;RODRIGUEZ, HECTOR F. |
| 分类号 |
G06F1/18;H05K1/14;H05K7/14;(IPC1-7):H05K1/14 |
主分类号 |
G06F1/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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