| 摘要 |
PROBLEM TO BE SOLVED: To form via holes in metal foils at low costs by forming predetermined holes in one of the metal foils and an insulating film using laser light. SOLUTION: A metal foil 2 and a metal foil 3 formed of copper foil are laminated on both surfaces of an insulating film 1, and then laser light 4 is injected onto the resulting film 1 through a previously prepared predetermined patterned mask from the side of the foil 2 to form circular holes 5 and 6 in the film 1 and the foil 2 simultaneously. A metal plating 7 is applied on these holes 5 and 6 to form a conduction via 8. At the same time, a predetermined ground layer 2' is formed from the foil 2. Further, a backing agent 9 and a resist 10 are applied, respectively, to the layer 2' and the foil 3, after which the resist 10 is exposed and developed to form a signal layer 3'. Then, the layers 2' and 3' are subjected to a predetermined process to form a TAB tape 11. |
