| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily perform bonding, even if parallelism is poor or in the event of dust and the like on the upper surface of a semiconductor chip, when the semiconductor chip is mounted through bonding on a flexible wiring board. SOLUTION: In this bonding head, a plurality of plates 21 are disposed to horizontally move in a heating frame 11, and each of the plates 21 is energized downward by energizing force of coil springs 24. Furthermore, when the upper surface of a semiconductor chip is inclined, a plurality of the plates 21, which are in contact with the upper surface of the semiconductor chip, each move upward according to the inclination of the upper surface of the semiconductor chip while opposing against the energizing force of the coil springs 24. Consequently, even in the case of a poor average degree, it is possible to uniformly apply pressure and heat to the upper surface of the semiconductor chip, because of a plurality of the plates 21 brought into contact with the upper surface of the semiconductor chip. |
