| 摘要 |
PROBLEM TO BE SOLVED: To reduce the time required for testing the self-testing circuit of a chip and dispense with an external testing unit by providing a BIST(built-in self testing) unit on a wafer for which a burn-in process is executed. SOLUTION: Many semiconductor chips 2 are arranged on a semiconductor wafer 1, and contact cushions or pads 11 are arranged on these chips 2. Then, pins for a burn-in process to be performed are arranged through these pads 11. As a result, all the burn-in process is controlled by BIST units 7. Each unit 7 is arranged within a cut edge 3 of the corresponding chip 2 to be connected to a bus 4, and to the corresponding cushion or pad 11 for the contact pin using a line 10. As a result, external testing units can be dispensed with, and hence the testing time can be reduced.
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