发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM RESIST USING THE SAME
摘要 PROBLEM TO BE SOLVED: To make it possible to obtain an excellent sensitivity, resolving power, adhesion, preservation stability, etc., by incorporating a specific amount of a specific photopolymerization initiator as an ethylenically unsaturated com pound into the above composition and further, incorporating an N-aryl-α-amino acid-base compound as a photopolymerization initiator therein. SOLUTION: The photosensitive resin composition consisting of a carboxyl group-containing polymer, the ethylenically unsaturated compound and the photopolymerization initiator contains the photopolymerization monomer expressed by formula as the ethylenically unsaturated compound at 3 to 50 wt.% of the entire part of the ethylenically unsaturated compound and further, contains the N-aryl-α-amino acid-base compound as the photopolymerizable initiator. In the formula, R1 is hydrogen or methyl group; R2 is 1-4C alkyl group; R3 is 4-14C alkyl group; (m) is an integer from 3 to 20; (n) is an integer from 0 to 9; (l) is an integer from 1 to 3. The content of the photopolymerization monomer is further preferably 5 to 30 wt.%, more preferably 5 to 20 wt.%.
申请公布号 JP2000321767(A) 申请公布日期 2000.11.24
申请号 JP19990126506 申请日期 1999.05.07
申请人 NICHIGO MORTON CO LTD 发明人 HIUGA ATSUYOSHI;YAMAMOTO HISATOSHI
分类号 G03F7/031;C08F2/50;C08F20/28;C08F290/06;G03F7/004;G03F7/027 主分类号 G03F7/031
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