| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device in which an underfill resin can be prevented from peeling off by reducing warping of an insulating substrate when the underfill resin between a semiconductor chip and the insulating substrate is cured, and a manufacturing method thereof. SOLUTION: In a semiconductor device in which a semiconductor chip 12 is flip-chip mounted on a resin substrate 11 through a underfill resin 19, the length of a fillet 20 formed on the side edge face of the semiconductor chip 12 by implanting the underfill resin 19 is made longer than the distance between the surface of the resin substrate 11 and the rear side of the semiconductor chip 12. By doing this, when the underfill resin 9 between the semiconductor chip 12 and an insulating substrate is cured, warping of the insulating substrate can be reduced. Thus, the underfill resin 19 can be prevented from peeling off, and further, the resin substrate 11 can be protected against cracking.</p> |
