| 摘要 |
PROBLEM TO BE SOLVED: To increase an assembly yield in bonding by forming a slit of a specified width on outer periphery of an electrode in connect with a signal line, and providing another electrode connected to a signal line that is different from the aforementioned one on the outside of the outer periphery of the slit. SOLUTION: By forming a circular slit 101 in a conductor constituting pads, an electrode 102 inside the slit 101 and an electrode 103 outside the slit 101 are installed electrically separatedly by the slit 101. The electrode 102 inside the slit 101 is connected to a conductor 107 in one step downside via a contact 106 with a signal line that is different from the signal line connected to the electrode 102. On the other hand, the electrode 103 outside the slit 101 is connected to a rectangular bonding-optional signal line 105 on the same step, inside of which is hallow. Thereby, an assembly yield in bonding can be increased. |
