| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor processor capable of preventing or reducing generation of a slip of a wafer, and a manufacturing method for a semiconductor device. SOLUTION: A holding member 229 is provided in a reaction pipe 2. A projected part 31 projecting outside a wafer mounter 30 is held by a holding part 220 of a holding member 229, and a projected part 31' is held by a holding part 220', whereby the two wafer mounters 30 are laminated vertically and held, and two semiconductor wafers 3, 3 are laminated vertically. A round opening larger than a semiconductor wafer 3 is formed in each wafer mounter 30, and the semiconductor wafer 3 is horizontally supported within the opening by a wafer support part 32 projecting inside the opening, to process the semiconductor wafer 3. A projected part 31 of the wafer mounter 30 is mounted on an arm 12 of a carrier 11, and in a state that a projected part 31' is mounted on an arm 12', the semiconductor wafer 3 is carried in or out. |
