| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to prevent the occurrence of development defects and to obtain excellent resist pattern profiles and the definition of contact holes by incorporating a resin which contains specific repeating units and is increased in a dissolution rate in an alkaline developer by the effect of an acid and a compound which generates the acid by irradiation with active rays or radiation into the above composition. SOLUTION: This composition contains a resin which contains one kind of the repeating units of formula I and formula II, the repeating units of formula III, formula IV, etc., and is increased in a dissolution rate in the alkaline developer by the effect of the acid a compd. which generates the acid by irradiation with active rays or radiation. In the formulas I to IV, R1 denote hydrogen atoms or methyl groups; R2 denotes 1-4C alkyl group; R3, R4 denote hydrogen atoms, etc.; R5 to R12 denote hydrogen atoms or (substituted) alkyl groups; R denotes a hydrogen atom, etc.; (m) denotes an integer from 1 to 10; X denotes a single bond or bivalent groups, such as (substituted) alkylene group and cyclic alkylene group, which are alone or are combined and are not decomposed by the effect of the acid. |
