发明名称 Group III nitride compound semiconductor on silicon and an epitaxial method of manufacturing the same
摘要 <p>A layer comprising silicon oxide (SiO2) is formed on (111) plane of a silicon (Si) substrate in a striped pattern which is longer in the Ä1-10Ü axis direction perpendicular to the Ä110Ü axis direction. Then a group III nitride compound semiconductor represented by a general formula AlxGayIn1-x-yN (0</=x</=1, 0</=y</=1, 0</=x+y</=1) is laminated thereon. The group III nitride compound semiconductor represented by a general formula AlxGayIn1-x-yN (0</=x</=1, 0</=y</= 1, 0</=x+y</=1) grows epitaxially on the substrate-exposed regions B which are not covered by the SiO2 layer, and grows epitaxially on the SiO2 layer in lateral direction from the regions B. Consequently, a group III nitride compound semiconductor having no dislocations can be obtained. <IMAGE> <IMAGE></p>
申请公布号 EP1054442(A2) 申请公布日期 2000.11.22
申请号 EP20000110766 申请日期 2000.05.19
申请人 TOYODA GOSEI CO., LTD. 发明人 KOIDE, NORIKATSU;KATO, HISAKI
分类号 C30B25/02;C30B29/40;H01L21/20;H01L21/205;H01L33/16;H01L33/32;H01L33/34;H01S5/00;H01S5/323;(IPC1-7):H01L21/20 主分类号 C30B25/02
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